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  • Film & PCB mounter

     

    • Input type: cassette magazine, 8˝ & 12˝ wafer frame
    • Output: wafer frame cassette
    • Film type: UV & Polyimide film
    • UPH: 60 wafer frame ring 

     

  • Film to Film Pick & Place (before sputtering)

     

    • Input type: 8” / 12” UV wafer frame
    • Output: 8” / 12” Polyimide wafer frame
    • Vision inspection: strip align, unit align, marking,
      XY size, 4 side exposure, burr, offset, PCB reject,
      PRS, damaged parts
    • 24 turret picker type
    • Device size: 1.6x2.0 to 12x17
    • Gap between device on film: 1 mm
    • Gap between strip on film: 20mm
    • Gap between device to wafer frame: 10mm
    • UPH: 1.6x2.0 14k 

     

  • Film to tray Pick & Place system(after sputtering)

     

    • Input type: 8” / 12” Polyimide wafer frame
    • Output: tray (good/empty), bin (2 good, 1 reject, 1 purge) /
      Tube / Tape & Reel
    • Vision inspection: IO pad contamination,
      incomplete sputtering area, marking, chipping,
      unit damage
      (6 side Vision system type)
    • 24 turret picker type
    • UPH: 1.6x2.0 14k 

     

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