gnb_arrow

EnglishENG

맨위로

제품정보
  • Flip chip P&P System (Both-way type)

     

    • Tray to Boat / Boat to Jedec Tray
    • Application device : FCBGA (Min. 10x10~Max. 55 x 55 mm )
    • 5 Matrix Boat Magazine / 10 single Boat Magazine Loading
    • Conversion tool : Less 10 mins
      Boat block (Single&Matrix), Picker pad (device etc.)
    • Dual Pick up head / 6 Picker per each Head (each Z , θaxis motion )
    • Inspection Vision & Align Vision
    • Dual Boat Transfer
    • Dual Good Tray Transfer / Dual Reject Tray Transfer
    • Integration with Deflux system

     

  • Standard Pick & Place System

     

    • Flexible onloading method: Wafer frame ring, tray, tube, bowl feeder
    • Flexible offloading method: tray, tube, tape & reel, bin
    • Applicable device: MEMS, SIP, LGA, MCP, QFN etc
    • Wafer stage: capable for 8˝& 12˝ wafer ring
    • UPH: 14K (based on 800 units/strip, reject unit under 5%)
    • Vision inspection item: strip & unit align, dimension, marking, picker align (Reject unit pick up bypass)

     

  • Universal System

    • Input type: bowl feeder, wafer frame
    • Output: tray (min 2x2.5), tube, bin
    • Vision inspection: strip align, unit align, marking, XY size, 4 side exposure
    • 24 turret picker type
    • Device size: 2x2 ~ 20x20mm
    • Bowl to tube UPH: 20K
    • Wafer to tray UPH: 15K
    • Wafer to tube UPH: 20K
  • share
  • 페이스북
  • 트위터
  • 구글
  • 핀터레스트