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새로운 반도체장비 개발과
시장을 선도다양한 종류의 반도체 제조장비와
레이저를 이용한 반도체 완성품 패키지, PCB
마킹장비, 비전 검사장비를 개발해 국내는 물론이고
미국, 중국 등 세계 시장에 공급하고 있습니다.
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Products
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IC Package substrates
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3D AFVI handler
CONTACT
marketing!@genesem.com
Domestic
- 박이규 (이사)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- 김진욱 (수석부장)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
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FCCSP 3D Inspection System (Strip type)
- Loading type: cassette to cassette system
- Bump application: flat, round, copper pillar, PoP (big ball & bump)
- Scan time: 8 sec per strip
- Laser beam thickness: 10um
- Inspection item: diameter, height, damaged, dimple, FM, bridge, missing, pitch, warp, coplanarity, void
- 3D sensor swath: 16mm
TECHNICAL DOCUMENTS
IC Package substrate_FCCSP 3D Inspection System (Strip type).pdf (919.80 KB)
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FCBGA 3D Inspection System (tray type)
- Applicable size: 8x8 to 52.5x52.5mm
- Device thickness: 0.2mm to 1.6mm (typically 0.38mm)
- JEDEC tray: 135.9x315mm (7~13mm T)
- Dual tray feeding system
- Main inspection item: bump, warpage, cop
- UPH: see below (based on 10ea reject
sorting)
(For FCBGA, coin bump)
TECHNICAL DOCUMENTS
IC Package substrate_FCBGA 3D Inspection System (tray type).pdf (809.05 KB)
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