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Growing into a leading global
semiconductor equipment makerBy drawing on its competitive technologies in
manufacturing semiconductor equipment,
Genesem is constantly strengthening its global market
power as it lays the foundation for sustainable growth
into a blue chip semiconductor equipment company.
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A pioneer in the new semiconductor
equipment marketGenesem develops and supplies a wide array of
semiconductor manufacturing equipment and
laser markers, PCB markers, and vision inspection
systems to its clients around the world. -
Strengthening our global market dominance and
laying the foundation for sustainable growthAfter it relocates its headquarters to Songdo in June 2016,
Genesem will open a new chapter in the company’s history.
While integrating the factory with the R&D Center, Genesem
will make the production line five times bigger than it is now,
which will further increase our growth potential. -
Achieving remarkable growth by
creating new corporate valueGenesem is further enhancing its technical
competitiveness to maximize its corporate value and
to become a true leader in the global market.
KOR
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R&D Center
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New Businesses
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R&D Performance
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Patents & Certifications
R&D Center
Genesem’s R&D Hub
Built in Songdo in 2007, Genesem’s Techno Park R&D Center plays a pivotal role in the company’s R&D activities for the sustainable growth of the business, developing equipment such as laser applications, test handlers, pick & place machines, and stringers. Going forward, the center will continue its efforts to develop the highest caliber equipment by utilizing its original design technologies, while also developing universal application equipment in pursuit of untapped markets. As a result, our differentiated products will allow us to maintain our competitive edge in the market. At the center of all these initiatives are passionate R&D experts, including five who hold Ph.D. degrees and have more than 10 years of experience in R&D, as well as three who hold master’s degrees. In the future, we will increase the number of staff at the R&D center to reinforce research & development activities in pursuit of new markets.
- R&D staff account for 33% of the total workforce
- 10% of profits are invested in R&D expenses
- The integration of the R&D Center and the manufacturing factory slated for 2016 will only heighten our growth potential.
R&D Roadmap
We are actively expanding our sales portfolio
through new product and technology R&D activities
in a wide array of business areas.
New Equipment R&D
By leveraging our established R&D infrastructure,
we are able to concentrate on constant innovation and
new product development.
Technical Competitiveness
Based on our original design technologies,
we are developing high-performance equipment and realizing
tangible results.
New Businesses
The Genesem R&D Center is developing equipment
that offers universal application by integrating our core technologies.
R&D Performance
Genesem is channeling its R&D resources into developing innovative
new products and technologies.
| No | Task | Center | Details | Result |
|---|---|---|---|---|
| 1 | Test Handler | Genesem R&D Center | Electrical test devices for packages | Commercialized |
| 2 | Pick & place machines | High-speed package inspection and packaging equipment | Commercialized | |
| 3 | Package marking | Semiconductor package marking devices | Commercialized | |
| 4 | Singulation | Breaking devices | Commercialized | |
| 5 | Stringer | Tabber & stringers | Commercialized | |
| 6 | Short pulse laser with a fine via hole processor for 3D package lamination | Laser drilling equipment | Not for commercial use but to develop preceding technologies | |
| 7 | Developing LED packaging in-line automation systems | LED production facility | Commercialized | |
| 8 | Laser technology for ultra-high speed cutting of hybrid substrates | Laser-cutting equipment | Not for commercial use but to develop preceding technologies | |
| 9 | Establishing automated manufacturing administration software through ICBM integration technologies | Integrated management system of equipment | Under development |
R&D Milestones
Certifications
As of 2017, Genesem held 38 patents and utility model rights.
Patents
| No. | Technology/Equipment | Patent No. | Application Date | Registration Date |
|---|---|---|---|---|
| 1 | APPRATUS FOR PRESSING ALEAD FRAME OF ASEMICONDUCTOR PACKAGE | Patent No. 0443663 | Apr. 2002 | Jul. 2004 |
| 2 | PRESS DIE | Patent No. 055440 | Feb. 2004 | Feb. 2006 |
| 3 | STRUCTURE OF PRESS DIE | Patent No. 10-0560115 | Mar. 2004 | Mar. 2006 |
| 4 | A device for sortiong and tansferring substrate | Patent No. 10-1213224 | Jan. 2012 | Dec. 2012 |
| 5 | A device for sortiong and tansferring substrate | Patent No. 10-1239232 | Jan. 2012 | Feb. 2013 |
| 6 | A vision inspection system of the semiconductor substrate | Patent No. 10-1262836 | Feb. 2013 | May 2013 |
| 7 | A tray rotation device | Patent No. 10-1276267 | Feb. 2013 | Jun. 2013 |
| 8 | A strip pre-aligner | Patent No. 10-1304545 | May 2013 | Aug. 2013 |
| 9 | A solar cell fabrication system | Patent No. 10-1305008 | May 2013 | Aug. 2013 |
| 10 | A moving materials arranged Devices | Patent No. 10-1308650 | Aug. 2013 | Sep. 2013 |
| 11 | A soldering device | Patent No. 10-1341394 | May 2013 | Dec. 2013 |
| 12 | A turret picker device | Patent No. 10-1341399 | Aug. 2013 | Dec. 2013 |
| 13 | A film cutting device | Patent No. 10-1431206 | May 2014 | Aug. 2014 |
| 14 | A flipperring device | Patent No. 10-1431207 | May 2014 | Aug. 2014 |
| 15 | A package anligner | Patent No. 10-1448043 | May 2014 | Sep. 2014 |
| 16 | A vision inspection and marking system of the semiconductor package | Patent No. 10-1479039 | Jan. 2014 | Dec. 2014 |
| 17 | EMI shielding method of the semiconductor package | Patent No. 10-1501735 | Sep. 2014 | Mar. 2015 |
| 18 | A sputtering method for EMI shielding of the semiconductor package | Patent No. 10-1589242 | Aug. 2015 | Jan. 2016 |
| 19 | A sputtering method of semiconductor package | Patent No. 10-1590593 | Dec. 2015 | Jan. 2016 |
| 20 | The semiconductor package of the suction holding means | Patent No. 10-1599812 | Jan. 2014 | Feb. 2016 |
| 21 | The deburring brush assembly for EMI shielding | Patent No. 10-1629634 | Dec. 2015 | Jun. 2016 |
| 22 | The moving apparatus of semiconductor package | Patent No. 10-1638996 | Jan. 2016 | Jul. 2016 |
| 23 | Atreatment device for detaching the semiconductor packgae | Patent No. 10-1638995 | Jan. 2016 | Jul. 2016 |
| 24 | The singulator | Patent No. 10-1656337 | Feb. 2016 | Sep. 2016 |
| 25 | The singulator | Patent No. 10-1656342 | Mar. 2016 | Sep. 2016 |
| 26 | Ahousing for the removable of the semiconductor package for EMI shielding | Patent No. 10-1656334 | Feb. 2016 | Sep. 2016 |
| 27 | The stringer | Patent No. 10-1656344 | Mar. 2016 | Sep. 2016 |
| 28 | Laser scriber | Patent No. 10-1656341 | Mar. 2016 | Sep. 2016 |
| 29 | The solar cell production system | Patent No. 10-1656354 | Mar. 2016 | Sep. 2016 |
| 30 | The removable housing of the semiconductor package for EMI shielding | Patent No. 10-1694748 | 2016. 06 | 2017. 01 |
| 31 | EMI shielding burr removing device | Patent No. 10-1754942 | 2017. 03 | 2017. 06 |
| 32 | Multi chip picker | Patent No. 10-1754958 | 2017. 01 | 2017. 06 |
| 33 | Adhesive film desorption method of semiconductor package | Patent No. 10-1754965 | 2017. 03 | 2017. 06 |
| 34 | A semiconductor package detachment device | Patent No. 10-1784373 | 2017. 07 | 2017. 09 |
