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Growing into a leading global
semiconductor equipment makerBy drawing on its competitive technologies in
manufacturing semiconductor equipment,
Genesem is constantly strengthening its global market
power as it lays the foundation for sustainable growth
into a blue chip semiconductor equipment company.
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A pioneer in the new semiconductor
equipment marketGenesem develops and supplies a wide array of
semiconductor manufacturing equipment and
laser markers, PCB markers, and vision inspection
systems to its clients around the world. -
Strengthening our global market dominance and
laying the foundation for sustainable growthAfter it relocates its headquarters to Songdo in June 2016,
Genesem will open a new chapter in the company’s history.
While integrating the factory with the R&D Center, Genesem
will make the production line five times bigger than it is now,
which will further increase our growth potential. -
Achieving remarkable growth by
creating new corporate valueGenesem is further enhancing its technical
competitiveness to maximize its corporate value and
to become a true leader in the global market.
KOR
Home
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Products
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Flip chip & SMT automation / Memory card
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Ultrasonic welding
CONTACT
marketing!@genesem.com
CSO
- Scott Baik (Director)
- ysbaik@genesem.com
- Tel : +82-32-810-8322
- Mobile : +82-10-4005-0363
Domestic
- Elocar Park (General Manager)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- Neo Kim (General Manager)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
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Wafer Level Handlers
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Semiconductor / RF devices
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IC Package substrates
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Solar Cells
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LED
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Flip chip & SMT automation / Memory card
Flip chip & SMT automation / Memory card
Providing an optimized in-line type automation system
Our in-line type automation solutions connect different equipment on the semiconductor manufacturing line with conveyors or bridges. This allows us to customize our equipment to any existing equipment—whether our own brand or those of our competitors—to best serve customer needs. In particular, it is an effective solution to material and package damage risks that are likely to occur during the flip chip manufacturing process.
