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  • Wafer Marking Systems

     

    •  Wafer-level package & backside wafer marking perfectly without damaging the dies.
      - Applicable to 8˝ & 12˝ wafers
      - Configuration : wafer alignment, vision, laser, picker, SCARA Robot (dual hand / vacuum type)
      - Marking Accuracy : 5㎛
      - Vision for high quality & precise inspection recognition of waver position information & marking inspection

     

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