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  • Film frame mounting

     

    • PI & Kapton Tape mounting on CMOS wafer backside with dicing film removal
    • Wafer film frame loading by cassette
    • Fully Automatic Mounting type
    • Application Device : 8” & 12” wafers
    • Dicing film removal with UV curing
    • System handling accuracy : +/-50um
    • Standard handling UPH : 30EA

     

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