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새로운 반도체장비 개발과
시장을 선도다양한 종류의 반도체 제조장비와
레이저를 이용한 반도체 완성품 패키지, PCB
마킹장비, 비전 검사장비를 개발해 국내는 물론이고
미국, 중국 등 세계 시장에 공급하고 있습니다.
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Semiconductor / RF devices
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Trim/Form & Lamination
CONTACT
marketing!@genesem.com
Domestic
- 박이규 (이사)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- 김진욱 (수석부장)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
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Laser marking
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Test handler & tape/ reel
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EMI shield solution
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Trim/Form & Lamination
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Pick & Place handler
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AOI machine vision
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Trim Form Singulation System
- Application device : All
types of lead package
QFN (MLP), QFP, DIP, SOIC, SOT, TO, TSOP, TSSOP, PBGA, PLCC, etc. - Trim system SPM : 200 Form system SPM : 120
- M/Z or Cassette to Tray or Tube
- Full auto system
- PLC / PC available
- Cam location : bottom
- Tool up : link (cylinder)
- Feeding : syncronized index
TECHNICAL DOCUMENTS
Semiconductor :RF device_Trim Form Singulation System.pdf (1.69 MB)
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Lamination System
- Applicable leadframe size: 250x70 & 210x57
(leadframe size could be discussed) - Tape attach accuracy: ±0.25㎜ (without tape tolerance)
- Bubble or void: not allowed after x10 magnifier
- SPH: 300 strips / hour
- Conversion time: less 15 minutes
- Pressure adjustable type while attach
- Ionizer applied
- Warpage : 5 mils (max)
- No jamming with insert paper while pick and place
TECHNICAL DOCUMENTS
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