-
새로운 반도체장비 개발과
시장을 선도다양한 종류의 반도체 제조장비와
레이저를 이용한 반도체 완성품 패키지, PCB
마킹장비, 비전 검사장비를 개발해 국내는 물론이고
미국, 중국 등 세계 시장에 공급하고 있습니다.
ENG
Home
-
Products
-
Semiconductor / RF devices
-
Pick & Place handler
CONTACT
marketing!@genesem.com
Domestic
- 박이규 (이사)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- 김진욱 (수석부장)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
-
Laser marking
-
Test handler & tape/ reel
-
EMI shield solution
-
Trim/Form & Lamination
-
Pick & Place handler
-
AOI machine vision
-
Flip chip P&P System (Both-way type)
- Tray to Boat / Boat to Jedec Tray
- Application device : FCBGA (Min. 10x10~Max. 55 x 55 mm )
- 5 Matrix Boat Magazine / 10 single Boat Magazine Loading
- Conversion tool : Less 10 mins
Boat block (Single&Matrix), Picker pad (device etc.) - Dual Pick up head / 6 Picker per each Head (each Z , θaxis motion )
- Inspection Vision & Align Vision
- Dual Boat Transfer
- Dual Good Tray Transfer / Dual Reject Tray Transfer
- Integration with Deflux system
TECHNICAL DOCUMENTS
Semiconductor :RF device_Flip chip PnP System (Both-way type).pdf (1.78 MB)
-
-
Standard Pick & Place System
- Flexible onloading method: Wafer frame ring, tray, tube, bowl feeder
- Flexible offloading method: tray, tube, tape & reel, bin
- Applicable device: MEMS, SIP, LGA, MCP, QFN etc
- Wafer stage: capable for 8˝& 12˝ wafer ring
- UPH: 14K (based on 800 units/strip, reject unit under 5%)
- Vision inspection item: strip & unit align, dimension, marking, picker align (Reject unit pick up bypass)
TECHNICAL DOCUMENTS
Semiconductor :RF device_Standard Pick n Place System.pdf (1.76 MB)
-
-
Universal System
- Input type: bowl feeder, wafer frame
- Output: tray (min 2x2.5), tube, bin
- Vision inspection: strip align, unit align, marking, XY size, 4 side exposure
- 24 turret picker type
- Device size: 2x2 ~ 20x20mm
- Bowl to tube UPH: 20K
- Wafer to tray UPH: 15K
- Wafer to tube UPH: 20K
TECHNICAL DOCUMENTS
-
