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새로운 반도체장비 개발과
시장을 선도다양한 종류의 반도체 제조장비와
레이저를 이용한 반도체 완성품 패키지, PCB
마킹장비, 비전 검사장비를 개발해 국내는 물론이고
미국, 중국 등 세계 시장에 공급하고 있습니다.
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Products
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Semiconductor / RF devices
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EMI shield solution
CONTACT
marketing!@genesem.com
Domestic
- 박이규 (이사)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- 김진욱 (수석부장)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
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Laser marking
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Test handler & tape/ reel
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EMI shield solution
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Trim/Form & Lamination
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Pick & Place handler
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AOI machine vision
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Genesem Tape Mounter System (GTMS-Series)
- Input type: cassette magazine, 8˝ & 12˝ wafer frame
- Output: wafer frame cassette
- Film type: UV & Polyimide film
- UPH: 60 wafer frame ring
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Film to Film Pick & Place (before sputtering)
- Input type: 8” / 12” UV wafer frame
- Output: 8” / 12” Polyimide wafer frame
- Vision inspection: strip align, unit align, marking,
XY size, 4 side exposure, burr, offset, PCB reject,
PRS, damaged parts - 24 turret picker type
- Device size: 1.6x2.0 to 12x17
- Gap between device on film: 1 mm
- Gap between strip on film: 20mm
- Gap between device to wafer frame: 10mm
- UPH: 1.6x2.0 14k
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Film to tray Pick & Place system(after sputtering)
- Input type: 8” / 12” Polyimide wafer frame
- Output: tray (good/empty), bin (2 good, 1 reject, 1 purge) /
Tube / Tape & Reel - Vision inspection: IO pad contamination,
incomplete sputtering area, marking, chipping,
unit damage
(6 side Vision system type) - 24 turret picker type
- UPH: 1.6x2.0 14k
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