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새로운 반도체장비 개발과
시장을 선도다양한 종류의 반도체 제조장비와
레이저를 이용한 반도체 완성품 패키지, PCB
마킹장비, 비전 검사장비를 개발해 국내는 물론이고
미국, 중국 등 세계 시장에 공급하고 있습니다.
ENG
Home
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Products
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IC Package substrates
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Laser marking
CONTACT
marketing!@genesem.com
Domestic
- 박이규 (이사)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- 김진욱 (수석부장)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
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Green Laser Marking System
- Handler speed : 7 seconds/1 side marking, 11 seconds/2 side marking (based on 1mm Dia / 5ea marking)
- Type: 7 watt diode pumped Nd Yag laser (dual lens)
- Full Automatic Operation
- Reliable Unit / Strip / Substrate Handling
- Inlet / outlet vision
- Vision check item reject marking on patten, number, model name, mixed
- High Marking Position Accuracy +/- 50㎛
- Air blow installed
- Standalone dust collector
- Character marking or reject marking
- Gripper or vacuum feeding
- Selectable Laser Head Type Depends on Application
- Single/Dual Head Application
- Customized Design is Available
TECHNICAL DOCUMENTS
IC Package substrate_Green Laser Marking System.pdf (781.26 KB)
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UV Ink Marking System
- PCB gold fiducial marking system
- Marking accuracy : ±50 ㎛
- White & Black UV Ink applicable
- UV cure unit installed
- Strip align function
- Universal type of working table (Cater for all size of PCB)
- Marking spot size : 0.13㎜
- Marking speed : 635㎜ /sec
- Estimated UPH : 1028 Strips per hour
- Tact time : 3.5 sec per strip
- Vision check items : Pattern, NG Marking, Marking pilling-off, Orientation, Device, Turnover Misplaced
TECHNICAL DOCUMENTS
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CO2 Laser Marking System
- Applicable size
Width: 40mm ˜ 100mm
Length: 120mm ˜ 270mm
Minimum thickness: 0.1 mm - CO2, Air Cooling type
- Spot size : 60~70㎛
- UPH: 260 strips per hour ( handler 9 sec, marking 4 sec)
- PCB stack : 600 strips (PCB Stacker height : 200mm)
TECHNICAL DOCUMENTS
IC Package substrate_CO2 Laser Marking System.pdf (819.14 KB)
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