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새로운 반도체장비 개발과
시장을 선도다양한 종류의 반도체 제조장비와
레이저를 이용한 반도체 완성품 패키지, PCB
마킹장비, 비전 검사장비를 개발해 국내는 물론이고
미국, 중국 등 세계 시장에 공급하고 있습니다.
ENG
Home
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Products
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IC Package substrates
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Cleaning & Sorting
CONTACT
marketing!@genesem.com
Domestic
- 박이규 (이사)
- elocar@genesem.com
- Tel : +82-32-810-8328
- Mobile : +82-10-8807-3013
Overseas
- 김진욱 (수석부장)
- neokim@genesem.com
- Tel : +82-32-810-8323
- Mobile : +82-10-4598-6556
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PCB Sorting & Cleaning System
- Reliable Substrate Handling with High UPH
- High Speed PLC Control, Touch Screen
- 4 secs tack time(substrate stack, without interleaf basis)
- Built-in Vacuum Generator
- Reliable Picker/Feeding & XYZ Sorting Transfer
- Universal Loading Vacuum Table
- In Let Vision for Sorting - Air Cleaning Unit(Option)
- 98% removable for floating particle(over 0.1㎜ size)
- Ionizer: In & Out let
- Air Knife Vacuum Suction : Top & Bottom
- Cleaning Booth/Dust collector - Applied Substrate
- Normal PCB(BGA, CSP etc) FCCSP(Bumped Substrate) Interleaf Handling Function(option)
- Substrate Size: 20 ~100㎜(W), 100 ~300㎜(L) - Sorting Stock Box Off-Loading
- 5 Low/4 Layer(20 box)
- Selectable Sorting Box Allocation by User - Additional Function
- 2D barcode, strip counter, Inspection data base
TECHNICAL DOCUMENTS
IC Package substrate_PCB Sorting n Cleaning System.pdf (1.02 MB)
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