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Die Transfer (Recon) | GDRS-1000_FA
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ITEM |
DESCRIPTION |
|
Feeding direction |
•Left to right
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Material |
•400mm Ring frame / Tape (Roll)
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|
Loader |
•Wafer LD_MAC (Multiple Application Carrier)
•Ring Frame LD(Manual)
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Die(Package) Vision |
•Mapping & Top Vision
•1D & 2D Barcode Reading
•Bonding
Accuracy Check
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Die(Package) Handling |
•Gyro type Auto Tilt 보정
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Tape Mount Accuracy |
•XY±1mm
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Bonding Accuracy |
•<±15um
@ 3Sigma
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Unloader |
•MAC
(Multiple Application Carrier)
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Inspection |
•Mount
Accuracy, Tape유무, Void, 울림 등
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Sensing(FDC) |
•Tape
Tension, Chamber 압력, Picker Z-Speed/Position 등
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Interface |
•SECS/GEM,
FDC, RMS
- optional
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|
Foot print(mm) |
•About 4,700 X 3,060 X 2,150mm (L x D x
H)
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