Company

We are reinforcing our global competitiveness

Business Domains

Genesem is a manufacturer of essential equipment necessary for
the semiconductor back-end process industry

Semiconductor
back-end process (Packaging&Test)

STEP 01
Die Bonding
STEP 02
Lead wire connection
STEP 03
LASER Marking
STEP 04
Singulation
STEP 05
Handler, Pick and Place
STEP 06
Inspection T/R

PCB process

STEP 01
Completion of the entire process

(PCB
completion)

STEP 02
LASER Marking
STEP 03
Inspections

Inspection

Auromation
Auromation

Chip process

STEP 01
Completion of the entire process

Wafer chip completion

STEP 02
Wafer Inspections
STEP 03
Wafer Saws
Major Products

Genesem provides more than 50 types of semiconductor back-end process equipment.

Saw Singulation
  • After sawing the strip by PKG unit, sorting by tray
  • Applied line : PKG
EMI Attach/Detach
  • Attach PKG to Ring Frame for EMI shielding and Detach after shielding
  • Applied line : EMI Shield
LASER Application
  • Marking various types of marks on the product surface
  • Applied line : Wafer, FPCB, PKG etc
Pick and Place
  • High-speed handling and rejection sorting of various packaged products
  • Applied line : PKG
Genesem’s Competitiveness

Genesem has a competitive edge in the stability of its equipment, convenience of operational software, product quality, and swift technical support.

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