We are reinforcing our global competitiveness
| No. | Task | Center | Details | Result |
|---|---|---|---|---|
| 1 | Test Handler | Genesem R&D Center | Electrical test devices for Package | Commercialized |
| 2 | Pick&Place | High-speed package inspection and packaging equipment | Commercialized | |
| 3 | Package Marking | Semiconductor padage marking devices | Commercialized | |
| 4 | Singulation | Breaking devices | Commercialized | |
| 5 | Stringer | Tabber & stringers | Commercialized | |
| 6 | Short puse laser with a fine via hole processor for 3D package lamination | Laser drilling equipment | Not for commercial use but to develop preceding technologies | |
| 7 | Developing LED packaging in-line automation systems | LED production facility | Commercialized | |
| 8 | Laser technology for ultra-high speed cutting of hybrid substrates | Laser-cutting equipment | Not for commercial use but to develop preceding technologies | |
| 9 | Establishing automated manufacturing administration software through ICBM integration technologies | Integrated management system of equipment | Under development |
Development of 3D Bump Inspection
Development of 3D DC Test Handler
Development of EMI Shielding Attach/Detach(Gen 5)
Development of para Test Handler
Development of Full Auto Saw Singulation
Development of Automotive Power Package Test Handler
Development of Saw Singulation
Developed an inline machine for EMI Shielding
(cumently under demo test with STATSChipPac Korea)
Developed and supplied laser UV marking press systems
Completed development of EMC marking device
Developed a bowl-to-bulk loading system
(currently in the pilot production stage with Amkor Technology Korea)
Developed a stringer system (currently in the pilot production stage with Solaria USA)
Completed development of a Pick & Place machine for EMI Shielding (Skyworks)
Short laser fine via hole processor for 3D package lamination
(as part of national R&D projects)
LED singulation (ceramics) research
Test Handler research & development
Solar cell singulation development
LED package in-line automation system development (as part of national R&D projects)
Laser technology for ultra-high-speed cutting of hybrid substrates
(as part of national R&D projects)
Development of dispensing system for LED
Industry-academia collaborative R&D for 3D vision module
Successful completion of localizing green laser technology
Developed wafer ball 3D inspection equipment (completion of a national R&D project)
Developed 3D inspection handlers
Developed PCB ball inspection equipment (completion of a national R&D project)
Developed an LED laser marking system
Developed an auto BGA ball attach system
Developed an ultrasonic id & module attach system
Developed a micro SD auto routing system
Developed SD card vision inspection system
Developed SD card auto switch insert system
Developed SD card auto label attach system
Developed CCM lens assembly & auto focus system
(completed the national R&D project)
Developed QFN & MMC singulation system
Developed auto tape attach system
Developed the mechanical trimming and inspection equipment for RF module
(completed the national R&D project)
Developed auto pellet loader system for semiconductor manufacturing
Developed auto trim/form system for semiconductor manufacturing
본 홈페이지에 게시된 이메일 주소가 전자우편 수집 프로그램이나 그 밖의 기술적 장치를 이용하여 무단으로 수집되는 것을 거부하며, 이를 위반시 정보통신망법에 의해 형사처벌됨을 유념하시기 바랍니다 .
※ 정보통신망 이용촉진 및 정보보호 등에 관한 법률
* 제 50조의 2 (전자우편주소의 무단 수집행위 등 금지)
* 제74조 (벌칙) 다음 각호의 1에 해당하는 자는 1천만원 이하의 벌금에 처한다.
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