Die Transfer (Recon) | GDRS-1000_FA
ITEM |
DESCRIPTION |
Feeding direction |
•Left to right
|
Material |
•400mm Ring frame / Tape (Roll)
|
Loader |
•Wafer LD_MAC (Multiple Application Carrier)
•Ring Frame LD(Manual)
|
Die(Package) Vision |
•Mapping & Top Vision
•1D & 2D Barcode Reading
•Bonding
Accuracy Check
|
Die(Package) Handling |
•Gyro type Auto Tilt 보정
|
Tape Mount Accuracy |
•XY±1mm
|
Bonding Accuracy |
•<±15um
@ 3Sigma
|
Unloader |
•MAC
(Multiple Application Carrier)
|
Inspection |
•Mount
Accuracy, Tape유무, Void, 울림 등
|
Sensing(FDC) |
•Tape
Tension, Chamber 압력, Picker Z-Speed/Position 등
|
Interface |
•SECS/GEM,
FDC, RMS
- optional
|
Foot print(mm) |
•About 4,700 X 3,060 X 2,150mm (L x D x
H)
|