Genesem Inc. (CEO : Mr. David Han) announced that they have developped Flip Chip Ball &Bump Inspection by 3D Vision scanning on 26/Oct/2008. Genesem's 3D Bump &Ball Inspection system use 3D type Laser scanning inspection with 3D Camera, and inspect Bump & Ball's height and dimeters. Also especially this system can check Substrate's warpage degree together. 

Genesem's Director, Mr. YS Kim said, "Genesem already have 6 Set orders already from Taiwan customers and exported 3 set now. This mean our technology was approved by foreign customer and our target promotion is to sales on 30 set in Domestic, and 50 sets in Overseas." 

Electonic-News  http://www.etnews.com/news/device/device/2079617_1479.html